电路板维修基础术语
Solder Ball锡球.
Solder Bridging锡桥.
Solder Bump 焊锡凸块.
Solder Column Package锡柱脚封装法.
Solder Connection焊接.
Solder Cost焊锡着层.
Solder Dam锡堤.
Solder Fillet填锡.
Solder Levelling喷锡,热风整平.
Solder Masking(S/M)防焊膜绿漆.
Solder Paste锡膏.
Solder Plug锡塞(柱).
Solder Preforms预焊料.
Solder Projection焊锡突点.
Solder Sag 焊锡垂流物.
Solder Side焊锡面.
Solder Spatter溅锡.
Solder Splash贱锡.
Solder Spread Test散锡试验.
Solder Webbing锡纲.
Solder Webbing锡纲.
Solder Wicking渗锡,焊锡之灯芯效应.
Solderability可焊性.
Soldering软焊,焊接.
Soldering Fluid, Soldering Oil助焊液,护焊油.
Solid Content固体含量,固形分.
Solidus Line固相线.
Spacing间距.
Span跨距.
Spark Over闪络.
Specific Heat 比热.
Specification (Spec)规范,规格.
Specimen样品,试样.
Spectrophotometry分光光度计检测法.
Spindle主轴,钻轴.
Spinning Coating自转涂布.
Splay斜钻孔.
Spray Coating喷着涂装.
Spur底片图形边缘突出.
Sputtering溅射.
Squeege刮刀.
Stagger Grid蹒跚格点.
Stalagometer滴管式表面张力计.
StＡnd-off Terminals直立型端子.
Starvation缺胶.
Static Eliminator静电消除器.
Steel Rule Die(钢)刀模.
Stencil版膜.
Step Ａnd Repeat逐次重复曝光.
Step Plating梯阶式镀层.
Step Tablet阶段式曝光表.
Stiffener补强条(板).
Stop Off防镀膜, 阻剂.
Strain变形,应变.
StrＡnd绞(指由许多股单丝集束并旋扭而成的丝束).
Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电
由整流器所提供,应在阳极板与被镀件之间的汇
电杆与槽体液体中流通,但有时少部分电流也可能会
从槽体本身或加热器上迷走,漏失).
Stress Corrosion应力腐蚀.
Stress Relief消除应力.
Strike预镀.
Stringing拖尾.
Stripline条线.
Stripper剥除液(器).
Substractive Process减成法.
Substrate底材.
Supper Solder超级焊锡.
Supported Hole(金属)支助通孔.
Surface Energy表面能.
Surface Insulation Resistance表面绝缘电阻.
Surface Mount Device 表面粘装组件.
Surface Mounting Technology (SMT)表面粘装技术.
Surface Resistivity表面电阻率.
Surface Speed钻针表面速度.
Surface Tension表面张力.
Surfactant表面润湿剂.
Surge突流,突压.
Swaged Lead压扁式引脚.
Swelling Agents, Sweller膨松剂.
Swimming 线路滑离.
Synthetic Resin合成树脂.
*****T*****
Tab接点,金手指.
Taber Abraser泰伯磨试器.
Tackiness粘着性, 粘手性.
Tape Automatic Bonding (TAB)卷带自动结合.
Tape Casting 带状铸材.
Tape Test撕胶带试验.
Tape Up Master原始手贴片.
Taped Components卷带式连载组件.
Taper Pin Gauge锥状孔规.
Tarnish污化.
Tarnish 污化, 污着.
Teflon铁氟龙(聚4氟乙烯).
Telegraphing浮印,隐印.
Temperature Profile温度曲线.
Template模板.
Tensile Strength抗拉强度.
Tensiomenter张力计.
Tenting盖孔法.
Terminal端子.
Terminal Clearance端子空环.
Tetra-Etch氟树脂蚀粗剂.
Tetrafunctional Resin四功能树脂.
Thermal Coefficient of Expansion (TCE)热膨胀系数.
Thermal Conductivity导热率.
Thermal Cycling热循环,热震荡.
Thermal Mismstch感热失谐.
Thermal Relief散热式镂空.
Thermal Via导热孔.
Thermal Zone感热区.
Thermocompression Bonding热压结合.
Thermocouple热电偶.
Thermode发热体.
Thermode Soldering热模焊接法.
Thermogravimetric Analysis, (TGA)热重分析法.
Thermomechanical Analysis (TMA)热机分析法.
Thermoplastic热塑性.
Thermosetting热固性.
Thermosonic Bonding热超音波结合.
Thermount聚醯胺短纤席材.
Thermo-Via导热孔.
Thick Film Circuit厚膜电路.
Thief辅助阳极.
Thin Copper Foil薄铜箔.
Thin Core薄基板.
Thin Film Technology薄膜技术.
Thin Small Outline Package(TSOP)薄小型绩体电路器.
Thinner调薄剂.
Thixotropy抗垂流性,摇变性.
Three Point Bending三点压弯试验.
Three-Layer Carrier三层式载体.
Threshold Limit Value (TLV)极限值.
Through Hole Mounting通孔插装.
Through Put物流量,物料通过量.
Throwing Power分布力.
Tie Bar分流条.
Tin Drift锡量漂飘失.
Tin Immersion浸镀锡.
Tin Pest锡疫(常见白色金属锡为β锡,当温度低于13.2℃
时则β锡将逐渐转变成粉末状灰色α锡称为锡疫.
Tin Whishers锡须.
Tinning热沾焊锡.
Tolerance公差.
Tombstoning墓碑效应.
Tooling Feature工具标示物.
Topography表面地形.
Torsion Strength抗扭强度.
Touch Up触修,简修.
Trace 线路,导线.
Traceability追溯性,可溯性.
Transducer转能器.
Transfer Bump移用式突块.
Transfer Laminatied Circuit转压式线路.
Transfer Soldering移焊法.
Transistor晶体管.
Translucency半透性.
Transmission Line传输线.
Transmittance透光率.
Treament, Treating含浸处理.
Treeing枝状镀物,镀须.
Trim修整, 精修.
Trim Line裁切线.
Trimming修整,修边.
True Position真位.
Tungsten钨
Tungsten Carbide碳化钨.
Turnkey System包办式系统.
Turret Solder Terminal塔立式焊接端子.
Twill Weave斜织法.
Twist板扭.
Two Layer Carrier两层式载体.
*****U*****
UL Symbol(UL.为Under-Writers 保俭业试验所标志.
Laboratories,INC)
Ultimate Tensile Strength (UTS)极限抗拉强度.
Ultra High Frequency (UHF)超高频率.
Ultra Violet Curing (UV Curing)紫外线硬化.
Ultrasonic Bonding超音波结合.
Ultrasonic Cleaning超音波清洗.
Ultrasonic Soldering超音波焊接.
Unbalanced Transmission Line非平衡式传输线.
Undercut, Undercutting侧蚀.
Underplate底镀层.
Universal Tester汛用型电测机.
Unsupported Hole非镀通孔.
Urea尿素.
Urethane胺基甲酸乙脂.
Vacuoles焊洞.
Vacuum Evaporation(or Deposition)真空蒸镀法.
Vacuum Lamination真空压合.
Van Der Waals Force凡得华力.
Vapor Blasting蒸汽喷砂.
Vapor Degreasing蒸汽除油法.
Vapor Phase Soldering气相焊接.
Varnish凡力水,清漆(树脂之液态单体).
V-cutV型切槽.
Very Large-Scale Integration(VLSI)极大绩体电路器.
Via Hole 导通孔.
Vickers Hardness维氏硬度.
Viscosity粘滞度,粘度.
Vision Systems视觉系统.
Visual Examination目视检验.
Void 破洞,空洞.
Volatile Content挥发份含量.
Voltage电压.
Voltage Breakdown崩溃电压.
Voltage Drop 电压降落.
Voltage Efficiency电压效率.
Voltage Plane电压层.
Voltage Plane Clearance电压层的空环.
Volume Resistivity体绩电阻率.
Volume Resistivity体绩电阻率.
Volumetric Analysis容量分析法.
Vulcanization交联,硫化.
*****W*****
Wafer晶圆.
Waive暂准过关,暂不检查.
Warp Size 浆经处理.
Warp, Warpage板弯.
Washer垫圈.
Waste Treatment废弃处理.
Water Absorption吸水性.
Water Break水膜破散,水破.
Water Mark水印.
Watt瓦特.
Watts Bath瓦兹镀镍液.
Wave Guide导波管.
Wave Soldering波焊.
Waviness 波纹,波度.
Wear Resistance耐磨性,耐磨度.
Weatherability耐候性.
Weave Eposure织纹显露.
Weave Texture织纹隐现.
Web蹼部.
Wedge Bond 楔形结合点.
Wedge Void楔形缺口(破口).
Weft Yarn纬纱.
Welding熔接.
Wet Blasting湿喷砂.
Wet Lamination湿压膜法.
Wet Process湿式制程.
Wetting Agent润湿剂.
Wetting Balance沾锡天平.
Wetting Balance沾锡,沾湿.
Whirl Brush旋涡式磨刷法.
Whirl Coating旋涡涂布法.
Whisker晶须.
White Residue白色残渣.
White Spot白点.
Wicking灯蕊效应.
Window操作范围,传动齿孔.
Wiping Action 滑动接触(导电).
Wire Bonding打线结合.
Wire Gauge线规.
Wire Lead金属线脚.
Wire Pattern布线图形.
Wire Wrap绕线互连.
Working Master工作母片.
Working Time (Life)堪用时间.
Workmanship 手艺,工艺水平,制作水准.
Woven Cable扁平编线.
Wrinkle皱折, 皱纹.
Wrought Foil锻碾金属箔.
*****X*****
X AxisX轴.
X-Ray X光.
X-Ray FluorescenceX萤光.
*****Y*****
Yarn纱线.
Y-AxisY轴.
Yield良品率,良率,产率.
Yield Point屈服点.
*****Z*****
Z-AxisZ轴.
Zero Centering中心不变(叠合法).
Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.